The Laser IC Opener has released PL101i and PL121i. These models are able to decap Cu wire IC and also perform decapsulation on ultra small packages in constant pursue for improvement in usability. It is possible to upgrade from the current standard type to the new "i" type.
PS105 is a Plastic Mold Decapsulation System with Precision Acid Auto-Mixing Function. This produces low or no sample damage, low cost and high quality decap.
Dry Decapper ES 312 is the excellent decapsulation system for the resin on electronic components such as IC, LED by Reactive Ion Gas.
We can promise the Efficient Dry Decapsulation for 3 samples at once by Automatic Matching and N2 gas regular blowing for residue.
Automatic Operation up to the end of Decap
Max 3 samples at once
High Repeatability Etching